{"has_more":false,"total_items":1,"itemsCrossref":[{"issue":4,"VG_ID":0,"published_date":2019,"journal":"Journal of Industry, Competition and Trade","volume":19,"page_from":641,"title":"On the Rationality of Bundled Rebate Program in Modem Chip Industry: an Analysis on Qualcomm’s Case","authors":[{"author_name":"Youqiong Ai"},{"author_name":"Thomas Y. Lu"}],"doi":"https://doi.org/10.1007/s10842-019-00311-6"}],"info_icon_message":"<div><b>Definition of Citations:</b><br><div align=left>This link gives the references of papers that cite this paper that have been resolved by SSRNs automated systems, with hot links to online versions of each paper where we have been able to locate them.","itemsSSRN":[]}